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Technology Articles
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Business
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Analysis roundup: Stinky economy, souring forecasts
The extent of the financial crisis is still unknown, of course, and most agree that it will get worse before it gets better. We've been gathering reports from leading market forecasters and analysts a ...
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Analyst: Intel, AMD both win in MPU sales
Unexpected strength in the PC market -- mostly from the notebook segment -- was good news for microprocessor (MPU) suppliers in 1Q08, with both AMD and Intel touting gains from different perspective, ...
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FM4910 evolves: Factory Mutual drops corrosion index, UL leads work for second test protocol
Faced with increasing industry pressure, Factory Mutual Research has removed the corrosion damage index from its FM4910 test standard for fire-safe plastics.
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Foundries maintain normal operations after second quake
By Christine Lunday, SST Online editor Two of Taiwan's leading chipmakers say they experienced no damages from another earthquake and subsequent aftershocks that hit the island early Friday, though eq ...
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Japan chipmakers increase spending, new fab lines planned
With plans for new wafer processing lines in the works, several Japan-based chipmakers have increased capital spending plans for the year -- good news for toolmakers eagerly awaiting the return of cap ...
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Cleaning
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AMAT's compact cleaning cluster for masks
by Ed Korczynski, Senior Technical Editor, Solid State Technology
April 23, 2008 - Cleaning has always been essential for mask manufacturing, but today there is increasing concern to the p ...
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Lithography
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Haze and sun for mask symposium
Highlights from last week's SPIE/BACUS Symposium on Photomask Technology in Monterey CA, include discussion of damage to pellicles caused by aggressive 193nm radiation, what's behind a new "sun effect ...
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Metrology
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Inside Rudolph's new inspection modules
Rudolph Technologies product manager Tuan Le tells SST about the improvements in its systems for detecting edge defects, necessitated by the switch to immersion lithography at 45nm.
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Up Front
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450mm odds & ends: 450mm trumps "School Prime," questioning TSMC's 450mm push
by SST editors Bob Haavind, Pete Singer, Debra Vogler
May 22, 2008 - Tidbits gleaned from conversations and presentations about the 450mm debate: Reflections on AMD's "200mm Prime" ...
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2007 IEDM: Darts hit elements all over the period table
Over 1600 technologists are gathered in Washington, DC, to explore a wide range of innovative ideas at the 2007 International Electron Devices Meeting (IEDM). While current mainstream CMOS approaches, ...
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Intel at IEDM: 45nm HK+MG, variation mitigation, Moore's Law beyond 2015
Intel execs revealed highlights from select papers the company will be presenting at IEDM, including some details about its 45nm HK+MG transistors that incorporate a redistribution layer as part of a ...
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Successful MEDEA+ collaboration to continue under CATRENE
This year's MEDEA+ annual forum in Budapest, Hungary (Nov. 26-28) reviewed final projects for the eight-year pan-European collaborate program for microelectronics R&D, set to expire in 2008 after over ...
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Interview: Chinese tool firm AMEC tips equipment, strategy
Gerald Yin, CEO and co-founder of equipment startup Advanced Micro-Fabrication Equipment Inc. (AMEC), discusses his company's foray into thin-film deposition and etch tools for leading-edge IC manufac ...
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Top Stories
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The case for leasing equipment
A ConFab session on "Capital Equipment: Alternative Financing Models" was kicked off by Craig Ignaszewski, director of capital equipment procurement, IBM, with discussion of the rationale for leasing ...
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Samsung to pay $300M in DOJ DRAM deal
October 14, 2005 - Samsung Electronics Co. Ltd. has agreed to pay a $300 million fine to the US Department of Justice regarding a single charge related to price-fixing allegations...
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iSuppli slashes 2005 chip outlook on energy, manufacturing woes
September 9, 2005 - Citing rising energy prices exacerbated by Hurricane Katrina, and a "troubling" production rampup even as prices and overall growth continue to slide, iSuppli Corp. has cut its for ...
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NA semi equipment industry posts May 05 b-to-b of 0.85
June 16, 2005 - North American-based manufacturers of semiconductor equipment posted $1.03 billion in orders in May 2005 (three-month average basis) and a book-to-bill ratio of 0.85, according to SEMI ...
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VLSI: Global tool orders off in April
Worldwide bookings for semiconductor manufacturing equipment totaled $3.72 billion in April, down 10.6% from March and 34.6% from a year ago, according to VLSI Research Inc.
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Tech Talk
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Toshiba, SanDisk ramping 43nm NAND flash with HK+MG, 3b/cell
Toshiba and SanDisk aim to increase their share of the NAND flash market by bringing down costs, as they accelerate the ramp of their new Yokkaichi Fab 4 next year, introducing 43nm geometries, high-< ...
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Axcelis mixes it up at high energy with latest implanter
WaferNEWS gets the scoop about Axcelis' new Optima XE high-energy single-wafer ion implanter, and why its broad energy range and even broader range of device applications addresses a particular ...
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Surface similarities hide big differences in display and photovoltaic needs
At first glance, flat-panel displays and solar cells seem to have a lot in common: both depend on diodes and transistors, usually implemented in silicon, and both are highly competitive markets where ...
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KLA-Tencor's WaferSight2 sees wafer nano-topo
With lithography depth-of-focus specs pushing on other areas of technology, one area that has taken up the slack is the starting silicon wafer's planarity. Another area of concern is minimizing a nano ...
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IMEC at IEDM: PVD for workfunction metals going forward?
Researchers at IMEC gave WaferNEWS a preview of the group's papers to be presented at next week's IEDM 2007 conference in Washington, DC. Topics include PVD used for workfunction electrode meta ...
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Technology News
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JSPA gets Korea patent for LED wafer scribing
Jan. 4, 2008 - JP Sercel Associates says it has been awarded a patent in Korea for its front-side laser scribing technique for LED wafers.
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Qimonda, Macronix extend pact for memory work
Jan. 3, 2008 - Germany's Qimonda and Taiwan's Macronix International have signed a deal to jointly develop nonvolatile memory technologies over a five-year period, sharing development costs and poolin ...
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IITC event adding 3D, process details to interconnect agenda
Jan. 2, 2008 - Responding to feedback from attendees, this year's IEEE International Interconnect Technology Conference (June 1-4, 2008) will widen its reach to include more content about 3D issues, a ...
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IBM licensing Infineon's 130nm embedded flash
December 21, 2007 - IBM has agreed to license Infineon Technologies' 130nm embedded flash technologies, expanding IBM's custom foundry services capabilities and giving Infineon an extra manufacturing ...
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ASML, Zeiss, Canon licensing litho tool IP
December 21, 2007 - ASML and Carl Zeiss SMT say they have agreed to cross-license patents with Canon in their respective fields of semiconductor lithography and optical components, meaning they can ma ...
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Feature Articles
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December 2007 Exclusive Feature #2: ISSM's spirited debate
By Debra Vogler, Senior Technical Editor
The International Symposium on Semiconductor Manufacturing (ISSM), running from Oct. 15-17 in Santa Clara, CA, was full of spirited debate, especially ab ...
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December 2007 Exclusive Feature #1: "In-the-trenches" roundup of ISMI
By Debra Vogler, Senior Technical Editor
The tradition of the ISMI Manufacturing Symposium as an "in the trenches" conference, by and for the people doing the actual day-to-day work in the fabs, c ...
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September 2007 Exclusive Feature:
SPECIAL REPORT:
The rise of solar power
By Phil LoPiccolo, Editor-in-Chief
The promise of photovoltaics (PV)—to solve the world's energy problems as well as fuel semiconductor industry growth—drew overflow crowds to presenta ...
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May 2006 Exclusive Feature:
Tackling future CMOS challenges outside Moore's Law
By Bob Haavind, Editorial Director, SST
Is Moore's Law dead -- and if so, does it really matter? That question, posed at a recent SEMI breakfast panel near Boston, brought some surprising ...
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March 2006 Exclusive Feature: INDUSTRY STRATEGY SYMPOSIUM
Special Report from the editors of SST
By Bob Haavind, Phil LoPiccolo, SST editors
Part 1: Chip industry set for resurgence, not maturity, predict ISS speakers
A recurrent debate during the 2006 Industry Strategy Symp ...
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Business News
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Analyst: Photoresist market still growing, thanks to 193nm DUV
June 24, 2008 - The photoresist market managed to grow for the sixth straight year in 2007, driven by demand for 193nm deep ultraviolet and consumption in Asia, according to recent data from Gartner.
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Report: Taiwan DRAM firms pushing out orders
Jan. 4, 2008 - Thanks to an ongoing harsh pricing environment, major DRAM manufacturers Winbond and Nanya have begun to push out equipment orders, according to a pair of reports.
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FormFactor appoints oil/gas services exec as president
Jan. 4, 2008 - Semiconductor test/probe equipment firm FormFactor has named a new president: Mario Ruscev, former president of testing services at Schlumberger Ltd., a technology/services provider in ...
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Not so fast: SIA nudges chip sales up
Jan. 4, 2008 - Days after sending out its monthly global semiconductor sales update, the SIA has revised the figures going back to September, to reflect an extra $1.35B in DRAM sales.
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Analyst clubs Cymer on Gigaphoton's US gains
Jan. 3, 2008 - Laser light source manufacturer Gigaphoton has made major inroads into US semiconductor manufacturers, enough to cause at least one analyst to sound the alarm for competitor Cymer Inc.
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