Centura Enabler E5
Applied Materials
Single-chamber dielectric etch
The Centura Enabler E5 dielectric etch system performs all the steps in a complex integration scheme (e.g., mask open, via, trench, resist strip and residue removal, barrier open) in a single chamber. Independent inner and outer wafer temperature tunability, high-power dual-frequency bias, and a modified gas delivery scheme achieve enhanced etch depth capability, superior etch rate, and CD bias uniformity as well as >80% bottom-to-top CD ratio with no profile bending (<3nm bowing of the contact sidewall). A patented high-frequency source for plasma density generation enables operation in either a low dissociation, high selectivity mode for ultra-thin photoresists or a high dissociation mode for removing PR and post-etch residues and for chamber cleaning. Ion flux and neutral species distribution are independently tunable to provide ultra-precise on-wafer performance. Applied Materials, Santa Clara, CA; ph 408/563-0647, www.appliedmaterials.com.
Enviro Xceed400
Ulvac Technologies,
Fast, compact resist/residue removal
The Enviro Xceed400 resist/removal tool achieves 400 wafers/hour throughput with small installation footprint (2000 x 2800) compared to other 300mm wafer processing tools. It incorporates a novel, proprietary vacuum transfer platform and a downstream plasma source capable of >10μm/min resist removal rate. Wafer transfer sequence is controlled and optimized by new software, doubling wafer throughput vs. the predecessor Enviro Optima. A RF wafer bias is available for difficult strip applications. Ulvac Technologies, Methuen, MA; ph 978/686-7550, www.ulvac.com.
NT series of aligners and measurement systems
EV Group
Aligners, measurement systems for 3D IC, MEMS
The NT series of aligners and measurement systems offer dramatically increased alignment accuracy (1μm down to 0.1μm) for advanced MEMS, compound semiconductor, silicon-based power, 3D IC, and nanotechnology devices. Two mask aligners handle substrates from 5mm-150mm and 3" to 8", respectively, and feature active vibration isolation and linear motors. A “SmartView” version featuring a high-precision alignment stage with top- and bottom-side microscopes can handle alignments from wafer-to-wafer, backside, and infrared transport; W2W alignments have demonstrated <0.3μm face-to-face accuracy, eliminating post-processing steps such as generating backside alignment keys and double-sided polishing. Alignment accuracies for the SmartView vs. its predecessor increased by more than 60%, 300%, and 40% for SmartView, backside and transparent alignments, respectively. Another version targets single- and double-sided structured wafers and bond interfaces, offering 200-300 measurements/hour, 5x better than its predecessor; accuracy is increased 60% to <0.2μm. EV Group, St. Florian, Austria; ph 43/7712-5311-0, www.evgroup.com.
V6000
Verigy
Flash and DRAM test on one tool
The V6000 product line enables testing of both flash and DRAM memory on the same automated test equipment platform by changing to a new test program and probe card. Three versions target engineering, wafer sort, and final test (multichip packages). Each version includes a patent-pending “Active Matrix” technology that provides massive parallelism (>18,000 I/O pins, a driver and comparator for each pin, and 4000 programmable power supplies), up to 4x that of conventional memory ATE architectures, and enables 300 mm one-touchdown probing on most devices. System performance and pin count can be upgraded by adding test site modules or Active Matrix modules. The systems are water-cooled, which require a smaller footprint and use less energy than air-cooled systems. Verigy, Cupertino, CA; ph 408/864-5987, www.verigy.com.
655D CVD
sp3 Diamond Technologies
Doped diamond deposition
The Model 655D CVD diamond deposition for doped diamond applications features a hot filament technology that incorporates electrically conductive diamond (resistivity from .05 to 10?-cm and “excellent” thickness uniformity), enabling applications such as implementing thin-film diamond in coated electrodes for water treatment and electrochemistry. Two dopant flow ranges offer flexibility to tailor processes with specific electrical characteristics. Adding gas loops to the baseline diamond deposition process enables delivery of boron dopant via hydrogen carrier gas. sp3 Diamond Technologies, Santa Clara, CA; ph 408/986-9190, www.sp3diamondtech.com.
AeroBar MP
MKS Instruments
Modulated pulse ionizing bar
The Ion Systems AeroBar MP Model 5625 offers efficient elimination of static charge in flat-panel display and related applications. A modulated pulse technology lowers swing voltage, reduces discharge times, and prolongs cleaning cycle times vs. conventional pulsed AC products. A high-frequency sine wave technology produces a continuous, high level of ion generation that enhances the product’s ability to repel airborne molecular contaminants. MKS Instruments, Andover, MA; ph 978/645-5500, www.mksinst.com.
Chemraz XTR
Greene, Tweed
Seal resistance to corrosive processes
The Chemraz XTR perfluoroelastomer, created in collaboration with Daikin Industries, targets highly corrosive fluorine environments (i.e., ClF3 and NF3), offering the highest available chemical resistance to thermal cleaning processes utilizing ClF3, notably ALD of nitride-based film deposition (e.g. TiN). Stability is maintained in temps ranging from -20°C to 300°C (-4°F to 572°F), and it can be used with bonded seals. Compression set capability is 31% (70 hrs @ 300°C @ 25% compression). Greene, Tweed, Kulpsville, PA; ph 636/536-0569, www.gtweed.com.
DC-Boost
FormFactor
Doubling DRAM test capacity
The DC-Boost test technology enables more efficient use of tester channels on test equipment to double the number of devices that can be tested simultaneously. It also minimizes drops in voltage that could lead to over- or under-testing of devices, and enables device test in isolation to obtain precise voltage measurements. The technology is being offered on FormFactor’s PH150XP and Harmony XP probe cards for DRAM wafer testing. FormFactor, Livermore, CA; ph 925/290-4681, www.formfactor.com.
Dyneon’s Adona emulsifier
Dyneon
Greener wafer manufacturing
Dyneon’s Adona emulsifier eliminates the use of ammonium perfluorooctanoate (APFO)?a salt derived from perfluorooctanoic acid (PFOA)?from production of fluoropolymers, which the EPA has mandated to be eliminated in 2015. Fluoroelastomers and perfluoroelastomers are used in semiconductor wafer manufacturing, notably in sealing applications requiring chemical and thermal resistance. The emulsifier also is suitable for recovery, recycle and re-use using Dyneon’s existing advanced containment technology, enabling recovery of the emulsifier from liquid dispersion products. Dyneon, Oakdale, MN; ph 651/733-5353, www.dyneon.com.
Halides
SAFC Hitech
Halides for scintillation
The new line of high-purity halides enables growth of scintillation detector crystals to improve performance in detection of X-rays, [gamma]-rays, and radioactive particles. The crystal growth halides line includes thallium iodide, as well as high-purity sodium and cesium iodide, improving upon traditional doped alkali halide materials. Target applications include X-ray and emission tomography, homeland security devices, and particle detection in high-energy physics and astronomy. Lanthanum and cerium bromides, as well as barium, strontium, and europium halides, are also available. SAFC Hitech, St. Louis, MO; ph 978/374.5200, www.sial.com.
PV IsoStation
Newport
PV workstation
The PV IsoStation series workstation offers a 36"×60" ergonomic workspace specifically for PV test and development applications, offering storage and shelving for instruments, solar simulators, and other devices. A specially treated worksurface (with a black Formica-covered composite material) reduces light reflectivity by a factor of six compared to typical optical table surfaces. Newport, Irvine, CA; ph 949/863.3144, www.newport.com.
ProberBench
Suss MicroTec Test Systems
Wafer-level probe software
The ProberBench Operating Environment is designed for efficient, intuitive, and safe wafer-level probing. Development of the interface and architecture was reportedly based on a three-month user study in the laboratories semiconductor design houses and manufacturers, who expressed needs such as less confusing interfaces, automated procedures, and easy-to-read feedback. The software suite includes a control center that provides instant feedback about wafer and probe positions. A SPECTRUM vision system supports up to four live video feeds, including a horizontal view of the probe tips and wafer for eliminating probe card and wafer damage and an upward-looking camera for viewing the tips of fine-pitch, vertical probe cards. An optional tool automatically aligns the wafer and generates a wafer map. The tool is designed to communicate with test executive software including Agilent’s IC-CAP, Keithley’s KITE, ProPlus’ BSIMPro, and many others. Suss MicroTec Test Systems, Dresden, Germany; ph 49/89-32007-395, www.suss.com.
Q304-HD
JDSU
High-powered ultra-violet laser
The Q304-HD high-powered ultra-violet (UV) laser provides 50% more power (>11W at 355nm) than its predecessors, with a “best in class” beam quality M2 <1.2, without using additional electrical consumption due to an enhanced laser design. Resulting higher throughput translates to higher rate of micromachining functions such as hole drilling, wafer cutting or singulation, and solar cell processing. It offers process control and flexibility for a wide range materials and machine integration conditions. JDSU, Milpitas, CA; ph 408/546-4567, www.jdsu.com.
RIE-330iP
SAMCO
High-volume GaN ICP etch
The RIE-330iP high-volume GaN inductively coupled plasma (ICP) etch system targets anisotropic etch of all types of semiconducting, insulating, and metallic films. It is equipped with 330mm trays and can process 27 20", 17 2.5", or seven 4" wafers, roughly 30%-40% increased productivity vs. other systems with 300mm trays. A “symmetrical shielded tornado coil” enables +/- 3% uniformity with an associated etch rate of 120nm/min. A cassette-to-cassette version of this system is also available. SAMCO, Sunnyvale, CA; ph , www.samcointl.com.
iVista LC
Suss MicroTec
High-res microscope
The iVista LC high-resolution digital microscope delivers images with resolution comparable to a 16mp color CCD, with unlimited digital zooming to provide detail and not just pixilated images. An automated objective changer allows switching from a navigation-magnification to a higher one for closer inspection and laser cutting; a standard laser port is available for mounting to laser cutters from all major manufacturers. An optional polarizer analyzer unit is included for liquid-crystal thermography applications. Suss MicroTec, Dresden, Germany; ph 49/89 32007 395, www.suss.com.
|
|
eNewsletter
Magazines
About Us
|
Advertise
|
Contact Us
|
Site Map
